XPJ(股份)有限公司官网

From September 9 to 11, TFC participated in the 27th China International Optoelectronic Exposition (CIOE 2026) at the Shenzhen World Exhibition & Convention Center, showcasing its new visual identity and latest optical interconnect products and solutions. Featuring a distinctive orange-and-blue design, TFC's new visual identity reflects its commitment to innovation and global growth, reinforcing its position as a leading one-stop optical interconnect technology company. 

Throughout the event, TFC welcomed customers and partners from across the optical communications ecosystem, engaging in discussions on technology development, market trends and emerging opportunities driven by AI computing infrastructure. 

Scaling AI, Advancing Optical Interconnect As AI models and applications continue to evolve, computing infrastructure is moving toward higher performance, greater scale and higher bandwidth. Scale-up and Scale-out architectures continue to evolve, while Scale-across is emerging to enable connectivity at an even broader scale. Together, these developments are driving growing demand for high-speed optical interconnect solutions. 

TFC continues to advance its optical interconnect products and solutions for 800G, 1.6T and other high-speed applications. TFC has realized mass production of 1.6T optical engines and continues to advance the development and commercialization of emerging optical interconnect technologies, including CPO and NPO, to address the evolving requirements of AI computing infrastructure. 

Looking ahead, TFC will remain focused on innovation and industrialization in high-speed optical interconnect. Working closely with customers and industry partners worldwide, TFC will continue to develop next-generation optical interconnect solutions and support the advancement of global AI computing infrastructure.